供应*整流桥堆*05F~*6F~*10F

品牌:TRR、东芝、中性 型号:*05F~*6F~*10F 应用范围:整流 结构:面接触型 材料:硅(Si) 封装形式:贴片型 封装材料:树脂封装 功率特性:*率 频率特性:低频 正向工作电流:0.5（A） *高反向电压:50~600~1000（V）

● Low profile space
● Ideal for automated placement
● Gl* p*ivated chip junction
● Low forward voltage drop
● Low leakage current
● High forward surge capability
● High temperature soldering：
260℃/10 seconds at terminals
● Component in accordance to
RoHS 2002/95/1 and WEEE 2002/96/EC
● Case: *F Molded plastic
over gl* p*ivated chip
● Terminals: Solder plated, solderable per
J-STD-002B and J*D22-B102D
● Polarity: Polarity symbols marked on body