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FEATUR*
· Plastic package has underwrites laboratory flammability
Cl*ification 94V-0
· Low profile surface mount package
· Built-in strain relief
· Fast switching for high efficiency
· Gl* p*ivated chip junction
· High temperature soldering
250℃/10 second at terminals
MECHANICAL DATA
· Case: JEDED DO-214AC molded plastic over
gl* p*ivated chip
· Terminals: Solder plated, solderable per MIL-STD-750, method 2026
· Polarity: Color band denotes cathode end
· Weight: 0.002ounce, 0.064 gram
是
肖特基管
是
GW
RS1A RS1B RS1G RS1M
硅(Si)