供应HITTITE缓冲器 HMC670LC32

品牌:HITTITE 型号:HMC670LC3C 批号:2010+ 封装:SMT 营销方式:库存 产品性质:* 处理信号:数模混合信号 制作工艺:半导体集成 集成程度:大规模 规格尺寸:3x3（mm） 工作温度:-40~85（℃）

HMC670LC3C是一款扇出为1:2的缓冲器，支持*13Gbps的数*送速率，时钟频率可*13GHz。*的差分输入和输出都采用直流耦合方式，片上通过50欧姆终端电阻连到地。输出可以采用单端或差分模式，传播延迟的典型值为55ps。HMC670LC3C具有24/22ps的典型上升和下降时间，2ps的抖动，功耗只有240mW。HMC670LC3C提供一个输出电平控制引脚，允许输出电压摆幅在0.4到1.1V之间调整，从而实现信号电平的优化。这些逻辑器件工作在单个3.3V直流电压之下，采用3x3mm SMT陶瓷封装.

The HMC670LC3C is a 1:2 Fanout Buffer designed to support data tran*ission rates up to 13 Gbps, and clock frequencies as high as 13 GHz. All differential inputs and outputs are DC coupled and terminated on chip with 50 Ohm resistors to ground. The outputs may be used in either single-ended or differential modes, and should be AC or DC coupled into 50 Ohm resistors connected to ground. The HMC670LC3C also features an output level control pin, VR which allows for loss compensation or for signal level optimization. The HMC670LC3C operates from a single -3.3V DC supply and is available in a ceramic RoHS compliant 3x3 mm SMT package.

Features • Inputs Terminated Internally in 50 Ohms • Differential Inputs are DC Coupled • Propagation Delay: 55 ps • Fast Rise and Fall Times: 24/22 ps • Programmable Differential Output Voltage Swing: 400 - 1100 mV • Power Dissipation: 240 mW • 16 Lead Ceramic 3x3mm SMT Package: 9mm²

T*ical Applications • RF ATE Applications • Broadband Test & Measurement • Serial Data Tran*ission up to 13 Gbps • Clock Buffering up to 13 GHz

Functional Diagram

深圳浩时健电子长期供应Hittite的放大器、衰减器、鉴相器、分频器、倍频器、混频器、调制器、模拟移相器、功率检测器、射频开关、压控振荡器VCO、PLOs和微波模块.*供应：

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