松下贴片机代理npm*多功能模块化贴片机

High area productivity with total mounting lines
Higher productivity and quality with placement and inspection process integration.

Configurable modules allow flexible line setup
Head location flexibility with plug-and-play functions.

Comprehensive control of lines, floor and factory with system software
Production plan support through line operation monitoring.

Model ID		NPM-D
Rear head Front head		16-nozzle head	12-nozzle head	8-nozzle head	2-nozzle head	Dispensing head	No head
16-nozzle head		NM-EJM1D				NM-EJM1D-MD	NM-EJM1D
12-nozzle head
8-nozzle head
2-nozzle head
Dispensing head		NM-EJM1D-MD				-	NM-EJM1D-D
Inspection head		NM-EJM1D-MA					NM-EJM1D-A
No head		NM-EJM1D				NM-EJM1D-D	-

PCB dimensions^*1 (mm)	Dual-lane mode	L 50 × W50 ~ L 510 × W 300
	Single-lane mode	L 50 × W50 ~ L 510 × W 590
PCB exchange time	Dual-lane mode	0s* *No 0s when cycle time is 4.5 s or less
	Single-lane mode	4.5s
Electric source		3-phase AC 200, 220, 380, 400, 420, 480 V 2.5 kVA
Pneumatic source ^*2		0.5 MPa, 100 L /min (A.N.R.)
Dimensions ^*2(mm)		W 835 × D 2 652 ^3 × H 1 444 ^4
M*		1 520 kg (Only for main body:This differs depending on the option configuration.)

Placement head		16-nozzle head ( With Dual Heads )	12-nozzle head ( With Dual Heads )	8-nozzle head ( With Dual Heads )	2-nozzle head ( With Dual Heads )
Placement speed		70 000cph (0.051 s/ chip)	62 500cph (0.058 s/ chip)	40 000cph (0.090 s/ chip)	8 500cph (0.423 s/ QFP)
Placement accuracy (Cpk1)		± 40 µm/chip		± 40 µm/chip ± 30 µm/QFP 12mm to 32mm ± 50 µm/QFP 12mm Under	± 30 µm/QFP
Component dimensions (mm)		(01005") 0402 chip^*6 to L 6 x W 6 x T 3	(01005") 0402 chip^*6 to L 12 x W 12 x T 6.5	(01005") 0402 chip^*6 to L 32 x W 32 x T 12	(0201") 0603 chip to L 100 x W 90 x T 28
Dispensing head		Dot dispensing		Draw dispensing
Dispensing speed		0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation)		3.75 s/component (Condition: 30 mm x 30 mm corner dispensing)
Adhesive position accuracy (Cpk1)		± 75 μ m /dot		± 100 μ m /component
Applicable components		1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP		SOP,PLCC,QFP, Connector, BGA, CSP
Inspection head		2D inspection head (A)		2D inspection head (B)
Resolution		18 µm		9 µm
View size (mm)		44.4 x 37.2		21.1 x 17.6
Inspection processing time	Solder Inspection ^*8	0.35s/ View size
	Component Inspection ^*8	0.5s/ View size
Inspection object	Solder Inspection ^*8	Chip component : 100 μm × 150 μm or more (0603 / 0201" or more) Package component : φ150 μm or more		Chip component : 80 μm × 120 μm or more (0402 / 01005" or more) Package component : φ120 μm or more
	Component Inspection ^*8	Square chip (0603 / 0201" or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector, Network resistor, Transistor, Diode, Inductor, Tantalum capacitor, Melf		Square chip (0402 / 01005" or more), SOP, QFP (a pitch of 0.3mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector, Network resistor, Transistor, Diode, Inductor, Tantalum capacitor, Melf
Inspection items	Solder Inspection ^*8	Oozing, blur, misalignment, abnormal shape, bridging
	Component Inspection ^*8	Missing, shift, flipping, polarity, foreign object inspection ^*7
Inspection position accuracy ^*9 ( Cpk1)		± 20 μm		± 10 μm
No. of inspection	Solder Inspection ^*8	Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine)
	Component Inspection ^*8	Max. 10 000 pcs./machine

*1 : As board transfer standard differ, it cannot be linked with dual-lane spec. NPM (NM-EJM9B).
*2 : Only for main body
*3 : Dimension D including tray feeder : 2 683 mm Dimension D including feeder cart : 2 728 mm
*4 : Excluding monitor and signal tower
*5 : It is the reference value of the tact time by the *9850 conformity.
*6 : The 0402 chip requires a specific nozzle/feeder.
*7 : Foreign object is available to chip components.
*8 : One head cannot handle solder inspection and component inspection at the same time.
*9 : This is the solder inspection position accuracy measured by our reference using our gl* PCB for plane calibration. It may be affected by sudden change of ambient temperature.
*Placement tact time, inspection time and accuracy values may differ slightly depending on conditions
*Please refer to the specification booklet for details.

设备名称

松下贴片机

型号/规格

MSR

品牌/商标

PANASONICS

原产地