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eMMC (Embedded MultiMediaCard) 为MMC协会所订立的内嵌式存储器标准规格,主要是针对手机产品为主。eMMC的一个明显优势是在封装中集成了一个控制器,它提供标准接口并管理闪存,使得手机厂商就能专注于产品开发的其它部分,并缩短向市场推出产品的时间。这些特点对于希望通过缩小光刻尺寸和降*的NAND供应商来说,具有同样的重要性。
eMMC结构由一个嵌入式存储解决方案组成,带有MMC (多媒体卡)接口、快闪存储器设备及主控制器——*在一个小型的BGA 封装。同时其接口电压可以是1.8v 或者是3.3v。接口速度*每秒50*甚至100*以上。由于采用标准封装,eMMC也很容易升级,并不用改*件结构。
eMMC的这种将NAND Flash芯片和控制芯片包在1颗MCP上的设计概念,就是为了简化产品内存储器的使用。客户*要采购eMMC芯片放进产品中,不需处理其它复杂的NAND Flash兼容性和管理问题,减少研发成本和大大缩短新产品的上市周期,加速产品的推陈出新速度。
Overview
Kingston’s 19nm e•MMC™ product follows the JEDEC e•MM*.5 standard. e•MMC encloses the MLC NAND and e•MMC
controller inside one JEDEC standard package, providing a standard interface to the host CPU. The e•MMC controller
directs the Flash management, including ECC, wear leveling, IOPS optimization and read sensing, significantly reducing the
storage management burden of the host CPU. It is an ideal universal storage solution for many electronic devices, including
*artphones, tablet PCs, PDAs, eBook readers, MIDs, di*al cameras and recorders, MP3, MP4 players, electronic learning
products, di*al TVs and set-* boxes. Not only used in consumer products, e•MMC is being adopted rapidly in embedded
applications, such as many Computer on Module (COM) designs, because of its compact size, low power consumption and
many enhanced features.
Key Benefits
• Simplifies the system design and reduces the time to market. The standard interface makes the fast-changing NAND
technology invisible to the host. The host processor doesn’t have to keep changing its software to accommodate every
NAND technology change and variation. This helps to significantly reduce the design-in complexity and shorten the
qualification cycle.
• Helps to improve the whole system performance. The e•MMC controller frees up the host processor’s valuable resources
from NAND management, so the host processor can use its processing power on other tasks.
• Provides a cost-effective solution. As opposed to SLC NAND, e•MMC uses MLC NAND. It makes higher capacity storage in
mobile devices much more affordable and enables today’s mobile devices to meet the increasing storage need.
19nm Part Numbers and Specifications Key Features
Part Number Capacity e•MMCStandard Package(mm) Category
KE4CN2H5A 4GB/153B Embedded MMC 4.5 11.5 x 13 x 1.0 Standard
KE4CN3H5A 8GB/153B Embedded MMC 4.5 11.5 x 13 x 1.0 Standard
KE4CN3K6A 8GB/169B Embedded MMC 4.5 12 x 16 x 1.0 Standard
KE4CN4A5A 16GB/153B Embedded MMC 4.5 11.5 x 13 x 1.2 Standard
KE4CN4K6A 16GB/169B Embedded MMC 4.5 12 x 16 x 1.0 Standard
KE4CN5B6A 32GB/169B Embedded MMC 4.5 12 x 16 x 1.2 Standard
KE4CN6C6A 64GB/169B Embedded MMC 4.5 12 x 16 x 1.4 Standard
Features e•MMC 4.5:
Boot operation √
Partitioning √
Sleep mode √
Replay protected√
memory block√
Trim √
Hardware reset √
Enhanced reliable write √
Background operation √
High prioritiy interrupt √
DDR interface √
Discard CMD √
Sanitize CMD √
Packed commands √
Context IDs √
Power off notification √
Data Tag √
RTC √
HS200 √
32G
2012
169
存储器
KE4CN5B6A
KINGSTON
手机
FBGA
EMM*.5