Note 1: General Applications - The power rating for general applications is based upon 0.5 sq. in. (300 mm2 ) of termination pad or trace area (2 oz. copper) connected to each end of the resistor. Maximum chip temperature is 150°C. Use Derating Curve to derate appropriay for the maximum ambient temperature and for the temperature limitations of the adjacent materials. Note 2: Thermal Resistance - In High Power Applications where the circuit board material provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal resistance of the chip resistor is useful to establish the maximum power capability of the chip resistor in the application. The film temperature is measured at the center of the resistor element and solder pad temperature at the center of the solderable pedestal (point X in the recommended circuit layout shown below). Maximum temperature of the chip resistor (at the center of chip) should not exceed 150°C through the temperature range of the application. Style FC Derating Curve For General Applications AMBIENT TEMPERATURE, C RATED LOAD, % o 100 80 60 40 20 0 0 C = Current connection S = Sense connection Note: Actual width of current trace is based on magnitude of current. Point of connection should be
