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1 Device Overview
1
1.1 Features 1
• General
– Integrates RF, Power Amplifiers (PAs), Clock,
RF Switches, Filters, Passives, and Power
Management
– Quick Hardware Design With TI Module
Collateral and Reference Designs
– Operating Temperature: –20°C to +70°C
– Small Form Factor: 13.3 × 13.4 × 2 mm
– 100-Pin MOC Package
– FCC, IC, ETSI/CE, and TELEC Certified With
PCB, Dipole, Chip, and PIFA Antennas
• Wi-Fi®
– WLAN Baseband Processor and RF Transceiver
Support of IEEE Std 802.11b, 802.11g, and
802.11n
– 20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO
at 2.4 GHz for High Throughput: 80 Mbps
(TCP), 100 Mbps (UDP)
– 2.4-GHz MRC Support for Extended Range
– Fully Calibrated: Production Calibration Not
Required
– 4-Bit SDIO Host Interface Support
– Wi-Fi Direct Concurrent Operation
(Multichannel, Multirole)
• Bluetooth® and Bluetooth low energy
(WL183xMOD Only)
– Bluetooth 4.2 Secure Connection Compliant and
CSA2 Support (Declaration ID: D032799)
– Host Controller Interface (HCI) Transport for
Bluetooth Over UART
– Dedicated Audio Processor Support of SBC
Encoding + A2DP
– Dual-Mode Bluetooth and Bluetooth Low Energy
– TI's Bluetooth- and Bluetooth Low EnergyCertified
Stack
• Key Benefits
– Reduces Design Overhead
– Differentiated Use Cases by Configuring
WiLink™ 8 Simultaneously in Two Roles (STA
and AP) to Connect Directly With Other Wi-Fi
Devices on Different RF Channel (Wi-Fi
Networks)
– Best-in-Class Wi-Fi With High-Performance
Audio and Video Streaming Reference
Applications With Up to 1.4× the Range Versus
One Antenna
– Different Provisioning Methods for In-Home
Devices Connectivity to Wi-Fi in One Step
– Lowest Wi-Fi Power Consumption in Connected
Idle (< 800 μA)
– Configurable Wake on WLAN Filters to Only
Wake Up the System
– Wi-Fi-Bluetooth Single Antenna Coexistence
1.2 Applications
• Internet of Things (IoT)
• Multimedia
• Home Electronics
• Home Appliances and White Goods
WiFi模块 (802.11)
100 Mbps
SDIO, UART
13.5 dBm, 17.3 dBm
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