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CMF-SD50A-2
Features:
■ Two resistance-matched PTCs in a ceramic housing
■ Aids compliance with:
- ITU-T K.20/21/45
- Telcordia GR-1089-CORE
- UL 60950, 3rd Ed.
■ Narrow resistance tolerance
Applications:
Used as a secondary overcurrent protection device in:
■ Customer Premise Equipment (CPE)
■ Central Office (CO)
■ Access equipment
Solder reflow:
• Recommended reflow methods: IR, vapor phase oven, hot air oven.
• Devices are not designed to be wave soldered to the bottom side of the board.
• Gluing the devices is not recommended.
• Recommended maximum paste thickness is 0.25 mm (.010 inch).
• Devices can be cleaned using standard industry methods and solvents.
Note:
• If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
Rework:
• A device should not be reworked
Packing:
• CMF-SD50A = 500 pcs. per reel
CMF-SD50A-2
BOURNS
电信用 陶瓷PTC自恢复保险丝
编带盘装