三菱模块PM450CLA060 450A
地区：江苏 南京
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三菱模块PM450CLA060 450A/600V
| 型号* | 厂商 | 封装 |
| SN74HC14DR | TI | SOIC-14 |
| SN74AHC245PWR | TI | TSSOP-20 |
| PC817X2NIPOF | SHARP | SMD |
| TL084CDT | ST | SOIC-14 |
| LM258DR | TI | SOIC-8 |
| PCA82C250T/YM,118 | NXP | SOIC-8 |
| TL074IDR | TI | SOIC-14 |
| 74HC139D | NXP | SOIC-16 |
| SN74LVC14ADR | TI | SOIC-14 |
| TJA1040T/CM,118 | NXP | SOIC-8 |
| SN74HC04DR | TI | SOIC-14 |
| SN65LBC184DR | TI | SOIC-8 |
| SN74HC245DWR | TI | SOIC-20 |
| NE555P | TI | DIP-8 |
| IRF9530NPBF | Infineon(英飞凌) | TO220 |
| PCA82C251T | NXP | SOIC-8 |
| SN74AHC138PWR | TI | TSSOP-16 |
| SN74AHC08PWR | TI | TSSOP-14 |
| SN74AHC574PWR | TI | TSSOP-20 |
| SN74AHC14PWR | TI | TSSOP-14 |
| SN74AHC273PWR | TI | TSSOP-24 |
| ULN2004ADR | TI | SOIC-16 |
| 74HC123D | NXP | SMD |
| SN74LVC245ADWR | TI | SOIC-20 |
| 74ALVC164245DL,118 | NXP | SSOP-48 |
| TL084CN | TI | DIP-14 |
| MSP430F4152IPMR | TI | LQFP-64 |
| MC74VHC1G00DFT1G | ON | 5-TSSOP |
| MC74VHC14DR2G | ON | SOIC-14 |
| EL2501(K)-G | 亿光 | DIP-4 |
| 74HC138D | TI | SOIC-16 |
| TL431ACDR | TI | SOIC-8 |
| ULN2003AN | TI | DIP-16 |
| SN74HC373N | TI | DIP-20 |
| SN74HC138N | TI | DIP-16 |
| TLP785GR | TOS | DIP-4 |
| AT24C64D-SSHM-T | MICROCHIP | SOIC-8 |
| LM2576SX-5.0 | TI | TO-263-5 |
| CD4511BE | TI | DIP-16 |
| ATMEGA16A-PU | MICROCHIP | DIP-4 |
| ATF16V8B-15PU | MICROCHIP | DIP-20 |
| AT24C08C-SSHM-T | MICROCHIP | SOIC-8 |
| 74LVC16245ADL | NXP | SSOP-48 |
| SN74HCT245NSR | TI | SSOP-48 |
| PCF8563T | NXP | SOIC-8 |
| MC3486N | TI | PDIP-16 |
| UC2844BD1R2G | ON | SOIC-8 |
| MAX485EPA | MAXIM(美信) | DIP-8 |
| SN74HC244NSR | TI | SOIC-2 |
PM450CLA060
MITSUBISHI（三菱）
无铅环保型
450A
600V
IPM
盒装
