供应信号电路 > 其他模拟IC THS7001IPWP
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| 参数名称 | 参数值 | ||
| Source Content uid | THS7001IPWP | ||
| Brand Name | Texas Instruments | ||
| 是否无铅 | 不含铅 不含铅 | ||
| 生命周期 | Active | ||
| Objectid | 1482482115 | ||
| 零件包装代码 | TSSOP | ||
| 包装说明 | HTSSOP, TSSOP20,.25 | ||
| 针数 | 20 | ||
| Reach Compliance Code | compliant | ||
| Country Of Origin | Taiwan | ||
| ECCN代码 | EAR99 | ||
| HTS代码 | 8542.33.00.01 | ||
| 风险等级 | 0.98 | ||
| Samacsys Description | 70-MHz High-Speed Programmable-Gain Amplifier | ||
| Samacsys Manufacturer | Texas Instruments | ||
| Samacsys Modified On | 2023/3/7 16:10 | ||
| YTEOL | 15 | ||
| 模拟集成电路 - 其他类型 | ANALOG CIRCUIT | ||
| JESD-30 代码 | R-PDSO-G20 | ||
| JESD-609代码 | e4 | ||
| 长度 | 6.5 mm | ||
| 湿度敏感等级 | 2 | ||
| 标称负供电电压 (Vsup) | -5 V | ||
| 信道数量 | 1 | ||
| 功能数量 | 1 | ||
| 端子数量 | 20 | ||
| 封装主体材料 | PLASTIC/EPOXY | ||
| 封装代码 | HTSSOP | ||
| 封装等效代码 | TSSOP20,.25 | ||
| 封装形状 | RECTANGULAR | ||
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | ||
| 峰值回流温度（摄氏度） | 260 | ||
| 电源 | +-5/+-15 V | ||
| 子类别 | Other Analog ICs | ||
| 标称供电电压 (Vsup) | 5 V | ||
| 表面贴装 | YES | ||
| 技术 | BIPOLAR | ||
| 温度等级 | INDUSTRIAL | ||
| 端子面层 | NICKEL PALLADIUM GOLD | ||
| 端子形式 | GULL WING | ||
| 端子节距 | 0.65 mm | ||
| 端子位置 | DUAL | ||
| 宽度 | 4.4 mm |
THS7001IPWP
TI
TSSOP-20
22+
