台湾泰谷(正芯)信号灯 LED 绿光二*管 led发光二* led信号灯

地区:广东 深圳
认证:

深圳市兴辉光电有限公司

普通会员

全部产品 进入商铺

 











































Features

?High luminous power.

?Green color.

?Bulk, available taped on reel.
?*D-withstand voltage: up to 4KV

?The product itself will remain within RoHS compliant version.

Descriptions

?The series is designed for application required high luminous intensity.

?The phosphor filled in InGaN chip to ideal white.

Device Selection Guide

LED Part No.

Chip Material

Lens Color

G5114UC

InGaN

Water clear

Package Dimensions

 

Absolute Maximum Ratings (Ta=25)

Parameter

Symbol

Rating

Unit

Continuous Forward Current

IF

30

mA

Peak Forward Current

IFP

1

A

Reverse Voltage

VR

5

V

Operating Temperature

Topr

-40 ~ 85

Storage Temperature

Tstg

-40 ~ 85

Soldering Temperature

Tsol

260

Power Dissipation at25℃Free Air Temperature

Pd

110

mW

Zener Reverse Current

Iz

100

mA

Notes:1:IFPConditions--Pulse Width≦100μs and Duty≦1%.

2:Soldering time≦5 seconds.

 

Electro-Optical Characteristics (Ta=25)

Parameter

Symbol

Condition

Min

T*

Max

Unit

Forward

VF

IF=20mA

2.8

--

3.6

V

Zener Voltage

Vz

Iz=5mA

5.2

--

--

V

Reverse Current

IR

VR=5V

--

--

5

μA

Luminous Intensity

Iv

IF=20mA

8000

 

10000

mcd

View Angle

2θ1/2

IF=20mA

--

30

--

deg

Peak Wavelength

λp

IF=20mA

503

--

505

nm

 

Packing Quantity Specification

1. 1000PCS/Bag

 

Notes

1. Lead Forming

a)       During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.

b)       Lead forming should be done before soldering.

c)       Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it may break the LEDs.

d)      Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause failure of the LEDs.

e)       When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs.

 

2. Storage

a)       The LEDs should be stored at 30°C or less and 70%RH or less after being shipped fromXinghuiand the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material.

b)       Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur.

 

3. Soldering

a)       Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is recommended.

b)       Recommended soldering conditions:

 

Hand Soldering

DIP Soldering

Temp. at tip of iron

300Max. (60W Max.)

Preheat temp.

100Max. (60 sec Max.)

Soldering time

3 sec Max.

Bath temp. & time

260 Max., 5 sec Max

Distance

3mm Min.(From solder joint to epoxy bulb)

Distance

3mm Min. (From solder joint to epoxy bulb)

.

Remark

1. Above specification may be changed without notice. XingHui will reserve authority on material change for above specification.

2. When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. XingHui *umes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets.

3. These specification sheets include materials protected under copyright of XingHui company. Please don’t reproduce or cause anyone to reproduce them without XingHui’s consent.

 

加工定制

品牌/商标

台湾泰古芯片

型号/规格

G5112UC

种类

光学发射器件

波段范围

可见光

运转方式

连续式

激励方式

电激励式

工作物质

半导体

光路径

反射型外光路

输出形式

功率型

传输信号

宽带型

速度

*

通道

单通道

输出波长

502-505(nm)

线宽

100(mm)

颜色

绿色502-505NM

角度

25-30度

胶体高度

8.6MM