66AK2E05XABD25厂家_66AK2E05XABD25原装_66AK2E05XABD25采购_66AK2E05XABD25报价

产品规格

StatusACTIVETemp (oC)0 to 85Package | PinsFCBGA (ABD) | 1089Device MarkingViewPackage QTY | Carrier40PCI/PCIe4 PCIe Gen2New FlagUSB2Functional DiagramEMAC8-Port 1Gb Switch 2-Port 10Gb SwitchHiRelSPI3UART2应用范围Avionics and Defense Communications and Telecom Consumer Electronics Industrial Medical Security SpaceDisplay OptionsOn-Chip L2 Cache4096 KB (ARM Cluster) 512 KB (per C66x DSP core)Reference DesignY工作温度范围-40 to 100 0 to 85DSP MHz (Max)1250 1400DSP1 C66xDatasheetSPRS865DARM MHz (Max)1250 1400DRAMDDR3 DDR3LOther On-Chip Memory2048 KBRatingCatalogTI DesignYVideo Port (Configurable)ARM CPU4 ARM Cortex-A15I2C3操作系统Linux DSP/BIOS Wind River VxWorks Green Hills INTEGRITY封装Tray系列66AK2E05品牌Texas Instruments安装风格SMD/SMT工作温度- 40 C封装/外壳BGA-1089最高工作温度+ 100 CRoHSRoHS Compliant