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1.Material:
1.1 Housing:HI-Temp plastic UL 94V-0 Rated.
1.2 Contact:Copper Alloy(C5191H t=0.20mm).
1.3 Grounding:Copper Alloy(C5191H t=0.20mm).
*FINISH:
2.1 CONTA*S: GOLD FLASH IN(SEE: P/N) CONTA* AREA.
100U"MIN. TIN PLATING ON SOLDER TAILS.
50u" MIN. NICKEL UNDERPLATED ALL OVER.
2.2 Grounding: GOLD FLASH IN(SEE: P/N) CONTA* AREA.
100U"MIN. TIN PLATING ON SOLDER TAILS.
50u" MIN. NICKEL UNDERPLATED ALL OVER.
2.3 SHELL: GOLD FLASH ON SOLDER TAILS.
100U"MIN. NICKEL ON AREA .
3.Specification:
*Electrical Characteristics:
3.1 Current Rating:0.5A.
3.2 Voltage Rating:250V AC/DC
3.3 Dielectric Withstanding Voltage:AC 500V r.m.s.
3.4 Insulation Resistance:1000 M?minimum
at DC 500V.
3.5 Contact Resistance:100 m?maximum.
*Mechanical Performance:
3.6 Contact Retention Force:3.0N min./per contact
3.7 Mating Force:9.8N Max
3.8 Unmating Force:1.47N min and 9.80N max
*Environmental:
3.9 Operating Temperature:-20°~85°
4. Ordering Information:
国产
0.5mm板对板连接器(公母)
显示屏
板对板
U*
条形
注塑
*潮
青铜
LCP
2*X
2*X
系列(mm)
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