• 5000W peak pulse
capability at 10/1000μs
waveform, repetition rate
(duty cycles):0.01%
• Glass passivated chip
junction in P600 package
• Fast response time:
typically less than 1.0ps
from 0 Volts to BV min
• Excellent clamping
capability
• Typical failure mode is
short from over-specified
voltage or current
• Whisker test is conducted
based on JEDEC
JESD201A per its table 4a
and 4c
• IEC-61000-4-2 ESD
30kV(Air), 30kV (Contact)
• ESD protection of data
lines in accordance with
IEC 61000-4-2
• EFT protection of data
lines in accordance with
IEC 61000-4-4
• Low incremental surge
resistance
• Typical IR less than 2μA
when VBR min>12V
• High temperature
to reflow soldering
guaranteed: 260°C/40sec
/ 0.375”, (9.5mm) lead
length, 5 lbs., (2.3kg)
tension
• VBR @ TJ
= VBR@25°C
x (1+αT x (TJ
- 25))
(αT:Temperature
Coefficient, typical value
is 0.1%)
• Plastic package is
flammability rated V-0 per
Underwriters Laboratories
• Matte tin lead–free plated
• Halogen free and RoHS
compliant
• Pb-free E3 means 2nd
level interconnect is
Pb-free and the terminal
finish material is tin(Sn)
(IPC/JEDEC J-STD-
