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FEATUR*
· Plastic package has underwrites laboratory flammability
Cl*ification 94V-0
· Built-in strain relief, ideal for automated placement
· Gl* p*ivated chip junction
· Fast switching for high efficiency
· High temperature soldering
260℃/10 second
MECHANICAL DATA
· Case: JEDED DO-214AC molded plastic over
gl* p*ivated chip
· Terminals: Solder plated, solderable per
· MIL-STD-750, method 2026
· Polarity: Color band denotes cathode end
· Weight: 0.002ounce, 0.064 gram
MAXIMUM RATINGS AND ELE*RICAL CHARA*ERISTICS
· Ratings at 25℃ambient temperature unless otherwise specified.
· Single phase, half wave, 60Hz, resistive or inductive load.
· For capacitive load derate current by 20%.
MIC 上海申福
US1A US1B US1M
整流管
面接触型
硅(Si)
贴片型
塑料封装
1(A)
1000V(V)