图文详情
产品属性
相关推荐
供应商
Micron Technology
产品类别
Flash
说明
SLC NAND Flash Parallel 3.3V 1G-bit 128M x 8 48-Pin TSOP-I Tray
产品技术规格
欧盟限制某些有害物质的使用
Compliant
ECCN (US)
3A991.b.1.a
Part Status
Obsolete
HTS
8542.32.00.71
Cell Type
SLC NAND
Chip Density (bit)
1G
Architecture
Sectored
Boot Block
Yes
Block Organization
Symmetrical
Address Bus Width (bit)
28
Sector Size
128Kbyte x 1024
Page Size
2Kbyte
Number of Bits/Word (bit)
8
Number of Words
128M
Programmability
Yes
Timing Type
Asynchronous
Maximum Erase Time (s)
0.003/Block
Maximum Programming Time (ms)
0.6/Page
Interface Type
Parallel
Minimum Operating Supply Voltage (V)
2.7
Typical Operating Supply Voltage (V)
3.3
Maximum Operating Supply Voltage (V)
3.6
Operating Current (mA)
35
Program Current (mA)
35
Minimum Operating Temperature (°C)
0
Maximum Operating Temperature (°C)
70
Supplier Temperature Grade
Commercial
Command Compatible
No
ECC Support
Yes
Erase Suspend/Resume Modes Support
No
Simultaneous Read/Write Support
No
Support of Common Flash Interface
No
Support of Page Mode
Yes
Packaging
Tray
Supplier Package
TSOP-I
Standard Package Name
SOP
Pin Count
48
Mounting
Surface Mount
Package Height
1(Max)
Package Length
12
Package Width
18.4
PCB changed
48
Lead Shape
Gull-wing
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镁光
BGA
10000
面议
1000