EM63A165TS-6G

型号:EM63A165TS-6G

品牌:ETRONTEC

封装:TSOP54

无人载具、机器人、AI深度学习发展下，机器视觉之深度感测应用崛起下，结合机器视觉、深度学习算法和传感器之深度感测应用需求增温，钰立微电子与钰创科技共同发表3D-MAMEC Sub-System多眼深度量测撷取次系统(3D Multiple-Aperture Measurement Eye Capture Sub- System)–EX8038 ，采3D自然光深度图视觉IC/平台技术，计算距离可从二十公分至五公尺，广角81度视野、适切判读准确值落在标准偏差外的机率小于2%，无须主动光源，在白天强光或黑夜灰暗下，皆可提供先进的3D视觉，增加目标物的深度Z值准确度，快速转换成大数据3D点云 (Point Cloud)之数字数据。

16Mb

1Mx16

200/166/1433.3V, LVTTL50-pin TSOP2

64Mb

4Mx16

200/166/1433.3V, LVTTL54-pin TSOP264Mb

4Mx16

200/166/1433.3V, LVTTL54-ball FBGA (BM:8x8x1.2mm)64Mb

2Mx32

200/166/1433.3V, LVTTL86-pin TSOP264Mb

2Mx32

200/166/1433.3V, LVTTL90-ball FBGA (BK:8x13x1.2mm)128Mb

8Mx16

200/166/1433.3V, LVTTL54-pin TSOP2128Mb

8Mx16

200/166/1433.3V, LVTTL54-ball FBGA (BM:8x8x1.2mm)128Mb

4Mx32

200/166/1433.3V, LVTTL86-pin TSOP2128Mb

4Mx32

200/166/1433.3V, LVTTL90-ball FBGA (BK:8x13x1.2mm)256Mb

16Mx16

200/166/1433.3V, LVTTL54-pin TSOP2256Mb

16Mx16

200/166/1433.3V, LVTTL54-ball FBGA (BM:8x8x1.2mm)256Mb

32Mx8

200/166/1433.3V, LVTTL54-pin TSOP2512Mb

32Mx16

200/166/1433.3V, LVTTL54-pin TSOP2