inpaq 佳邦 贴片 压敏电阻

MLVS(Multilayer Varistor)積層晶片壓敏變阻器

1.SMD t*e zinc oxide based ceramic chip

2.Lead free plating termination provided good solderability characteristic
3.Insulator overcoat keeps excellent low and stable leakage current
4.Quick response time (<1ns)
5.Low clamping voltage
6.High transient current capability
7.Meet IEC 61000-4-2, 61000-4-4, and 61000-4-5 standard
5.Compact size for EIA 0201/0402/0603/1206

Application:

1.Applications for Mother Board, Notebook, Cellular Phone, PDA, handheld device, DSC, DV, Scanner,
and Set-Top Box…etc.

2.Suitable for Push-Button, Power Line and Low Frequency single line over voltage protect.1.SMD t*e zinc oxide based ceramic chip