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1. RATING額定值: | DC 12V0.5A | |||
2. OPERATIONTEMPERATURERANGE使用溫度範圍: | -30~ 70℃ | |||
3.PR*ERVATIVETEMPERATURERANGE:保存溫度範圍: | -40~ 85℃ | |||
4. CONSTRU*ION DIMENSION結構尺寸: | Apply to the appended drawing: *合附加圖紙 | |||
ITEM项目 | T*T CONDITION測試條件 | SPECIFICATION規格 | ||
5. ELE*RONICAL CHARA*ERISTICS.電氣性能. | ||||
5A | CONTA* R*ISTANCE 接觸阻* | Being measured at 1KHz *all current contact resistance meter. 在1KHZ小電流下測量. | 30mΩ max 30毫歐以下. | |
5B | INSULATION R*ISTANCE 絕緣阻* | Measurements shall be made following application of DC100V potential across terminals and across terminals and frame for 1 minute. 在端子之間和端子與殼之間加DC100V條件下,持續1分鐘測量. | 100MΩ min 100兆歐以上. | |
5C | WITHSTAND VOLTAGE 耐電壓 | AC 500V (50Hz or 60Hz) shall be applied across terminals and across terminals and frame for one minute 在端子之間和端子與殼之間加AC 500V(50HZ或60HZ)條件下,持續1分鐘測量. | There shall be no breakdown. 無擊穿現象出現.
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6. MECHANICAL CHARA*ERISTICS.機械性能. | ||||
6A
| A*IONPOWER 动作力 |
| Action Power 100&plu*n;350gf 动作力 100&plu*n;350gf | |
6B | TERMINAL STRENGTH 端子強度 | A static force of 500gf being applied in one direction on the tip of terminal for 1 minute. 一個500克之靜負荷施加於端子頂部的一個方向持續1分鐘。 | There shall be no sign of damage mechanically and electrically. 無任何迹象顯示機械及電氣性能之損壞. | |
7. DURABILITY.耐久性. | ||||
7A
| SOLDERING T*T. 可焊性試驗 | The tip of the terminals shall be dipped 2mm in the solder bath at a temperature of 230&plu*n;5℃for2&plu*n;0.5sec.端子頂部被浸入焊錫池2mm深,溫度230&plu*n;5℃時間2&plu*n;0.5秒。 | A new uniform coating of solder shall cover a minimum of90of the surface being immersed.浸入的部分90%以上表面將被錫覆蓋. | |
7B | R*ISTANCE TO SOLDERING HEAT 耐焊接熱 | Soldering area:t/2 of P.C.B thickness焊接面積:印刷基板的1/2厚度處 temperature:260&plu*n;5℃Sinkingtime: 5&plu*n;1S.焊接溫度:260&plu*n;5℃,焊接時間:5&plu*n;1秒。 | No damage (electrical and mechanical) 無異常。(電氣、機械特性) |
国产
UAB-AM 180°SMT
电脑
插头/插座
U*
单卡
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1
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1(mm)