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制造商: Molex
高速/模块连接器 CXP EF Short Body W/Cover 84Ckt
产品种类: 高速/模块连接器
产品: Connector Modules
位置数量: 84 Position
排数: -
节距: 0.8 mm
端接类型: Through Hole
触点电镀: Nickel
系列: 170501
电流额定值: 500 mA
外壳材料: Thermoplastic (TP)
安装角: Right Angle
电压额定值: 30 VAC/DC
高速/模块连接器 CXP EF Short Body W/Cover 84Ckt
商标: Molex
触点材料: Copper
最大工作温度: + 85 C
高速/模块连接器 CXP EF Short Body W/Cover 84Ckt
最小工作温度: - 40 C
产品类型: High Speed / Modular Connectors
工厂包装数量: 100
子类别: Backplane Connectors
零件号别名: 01705011001
Molex iPass+™ CXP Interconnect System
Molex's CXP interconnect system enables pluggable copper or optical options to increase the flexibility of system-level hardware for end users. The dual paddle-card system was adopted as the InfiniBand CXP, 12x QDR and IEEE 802.3ba as the 100G Ethernet standard, providing 10 lanes of 10Gbps data rates.
By leveraging high-speed wafer technology and compliant-pin tails, Molex has developed two integrated-connector offerings. The enhanced- footprint version is a high-density, 10-channel connector, conforming to IEEE 802.3ba requirements for the 10-channel 100Gigabit Ethernet interface. The standard version is a high-density, 12-channel connector capable of achieving Quad Data Rates (QDR) of 10Gbps. The one-piece press-fit connector and cage assembly provides one-step placement to the board and is offered in both single and stacked dual-port configurations.
高速/模块连接器 CXP EF Short Body W/Cover 84Ckt
Copper cables are designed to accommodate single, ganged, or stacked connector configurations in extremely high-density requirements. Low profile CXP optical 4.5mm round cable assemblies offer improved fiber management over traditional flat cables for connecting CXP transceivers.
538-170501-1001
ST(意法半导体)
普通型
Molex
17+
产品种类
子类别