■ 特点 Features
z 可以和半导体在同一装载机上自动装载。
z 端子节距1.27mm，最多可内藏15个电阻元件。
z 薄型结构，高度2.2mm以下。
z 对应回流焊、波峰焊接。
z 通过模压结构，提高了机械强度和信赖性。
z 对应欧盟RoHS。电极、电阻膜层、玻璃中所含铅玻璃，不
包含在欧盟RoHS指令中。内部连接使用欧盟RoHS不适用
的焊材。
z The same automatic mounter for semiconductors can be used.
z Max. 15 resistor elements can be built in with a 1.27mm
terminal pitch.
z Low profile : 2.2mm or lower.
z Suitable forboth reflow and flow solderings.
z Improved mechanical strength and reliability by molding structure.
z Products meet EU-RoHS requirements. EU-RoHS regulation
is not intended for Pb-glass contained inelectrode, resistor
element and glass. The solder,which is not applicable to EURoHS,
is also used for an inner connection.
