Array-Beam™ 高密度板对板连接器系统 The Array-Beam™ SMT board-to-board system combines ultra-low-profile mating height with increased circuit size capabilities to meet high-density signal requirements for applications such as CT scanners and ecommunications equipment.
Array-Beam™ 高性能连接器系统 - Molex Medical and high-end ecommunications makers continue to strive to design more compact products with increased functionality and higher bandwidth.To achieve this they need high-density connectors in smaller packages.The Array-Beam connector system offers the lowest profile in the highest circuit size available in the market today to meet these needs better than competitive designs. 深圳市原力达电子有限公司 ：// 传真： 网址：WWW.YLD.CC 503821-5281 类别PCB插座头 系列503821 应用板对板 概述Array-Beam™ High-Density Board-to-Board Connector System 产品名称Array-Beam™ UPC887191055657 断开否 电路数(已装入的)528 电路数(最多的）528 颜色-树脂黑色 耐用性(插拔次数) - 最多次数50 先接后断否 满足欧洲Glow-Wire标准否 插配高度4.00mm 材料-金属铜 材料-接合处电镀金 Net Weight2954.620/mg 行数12 方向垂直的 包装形式卷上凹盒带状 间距-接合界面1.27mm 间距 - 终端界面1.27mm 运行温度范围-55°C to +85°C 终端界面:类型表面贴装 每触点最大电流2A
