图文详情
产品属性
相关推荐
FEATURES
For surface mounted applications
Low profile package
Glass Passivated Chip Junction
High efficiency
Lead free in comply with EU RoHS 2011/65/EU directives
MECHANICAL DATA
Case: SOD-123FL
Terminals: Solderable per MIL-STD-750, Method 2026
Approx. Weight:15mg/0.00053oz
Maximum Ratings and Electrical characteristics
Ratings at 25 ambient temperature unless otherwise specified. Single phase half-wave 60 Hz, resistive or inductive load, for capacitive load current derate by 20 %.
US1AW~US1MW/SOD123-FL
JINGDAO/晶导微
SOD123-FL
普通型
贴片式
盒带编带包装