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FEATURES
Glass Passivated Chip Junction
Reverse Voltage - 100 to 1000 V
Forward Current - 1 A
High Surge Current Capability
Designed for Surface Mount Application
MECHANICAL DATA
Case: ABS/LBF
Terminals: Solderable per MIL-STD-750, Method 2026
Approx. Weight: 88mg 0.0031oz
Maximum Ratings and Electrical characteristics
Ratings at 25 ambient temperature unless otherwise specified. Single phase half-wave 60 Hz, resistive or inductive load, for capacitive load current derate by 20 %
ABS10/ABS
JingDao/晶导微
ABS
普通型
贴片式
盒带编带包装