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K4A4G045WE-BCPB 原装 DDR4
The 4Gb DDR4 SDRAM E-die is organized as a 64Mbit x 4 I/Os x 16banks or 32Mbit x8 I/Os x 16banks device. This synchronous device achieves high speed double-data-rate transfer rates of up to 2666Mb/sec/pin (DDR4- 2666) for general applications.
The chip is designed to comply with the following key DDR4 SDRAM features such as posted CAS, Programmable CWL, Internal (Self) Calibration, On Die Termination using ODT pin and Asynchronous Reset.
All of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the crosspoint of differential clocks (CK rising and CK falling). All I/Os are synchronized with a pair of bidirectional strobes (DQS and DQS) in a source synchronous fashion.
The address bus is used to convey row, column, and bank address information in a RAS/CAS multiplexing style. The DDR4 device operates
with a single 1.2V (1.14V~1.26V) power supply and 1.2V (1.14V~1.26V).
The 4Gb DDR4 E-die device is available in 78ball FBGAs(x4/x8).
K4A4G045WE-BCPB 原装 DDR4 的技术参数:
类别 |
集成电路IC |
产品类型 |
DRAM ; DDR4 |
封装 |
FBGA-78 |
容量 |
4 GB |
电压 |
1.2V |
架构 |
1G *4 |
工作温度 |
0 ~ 85 °C |
速率 |
2133Mbps |
RoHs Status |
Lead free / RoHS Compliant |
外包装 |
TRAY |
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K4A4G045WE-BCPB
SAMSUNG/三星
FBGA
22+
无铅/环保