原装KMDX60018M-B425多制层封装芯片

Integrated to bring flagship performance

Equip mobile devices for the age of AI and 5G. DRAM and NAND come together in a single compact package to deliver flagship-level performance. LPDDR5 uMCP brings high-bandwidth storage and memory, crucial for the increasingly data-heavy demands of smartphones, wearables, and AI technology. Take less space and offer capabilities for the ever-growing 5G world.

原装KMDX60018M-B425多制层封装芯片

eMMC EMCP32+3 BGA254 32GB emcp254 NAND Flash Memory IC Chip Original New

制造商 SAMSUNGeStorag

密度 32GB

eStorage 版本 eMMC 5.1

DRAM 密度 24 Gb

DRAM 类型 LPDDR4X

封装 254FBGA

速率 4266Mbps

全新原包原装可含税（香港可交）

KMGX6001BA-B514

KMGP6001BA-B514

KMFN60012M-B214

KMDX60018M-B425

KLMDG8JENB-B041

KLMCG4JETD-B041

KLMBG2JETD-B041

KLMAG1JETD-B041

KLM8G1GETF-B041

KLM4G1FETE-B041

K9F1G08U0E-SIB0

K4Z80325BC-HC14

K4G80325FC-HC25

K4E8E324ED-EGCG

K4E8E324EB-EGCF

K4E6E304EB-EGCF

K4E6E304ED-EGCG

K4E6E304EC-EGCG

K4E6E304EC-EGCF

K4B4G1646E-BYMA

K4B4G1646E-BYK0

K4B4G1646E-BCNB

K4E8E324EB-AGCF

K4B4G0846E-BYMA

K4AAG165WA-BCWE

K4AAG165WA-BCTD

K4A8G165WC-BCTD

K4A8G165WC-BCRC

K4A8G165WB-BCRC

K4A4G165WF-BCTD

K4A4G165WE-BCRC