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原装KLMDG8JENB-B041 嵌入式多媒体卡
128GB 2bit MLC 11.5mmx13mmx1.0mm-25°C - 85°C
制造商 - SAMSUNG
版本 - 嵌入式多媒体卡 5.1
容量 - 128GB
工作电压 - 1.8 / 3.3V
接口 - HS400
封装尺寸 - 11.5 x 13 x 1.2 mm
工作温度 - -25 ~ 85 °C
Packing - Tape & Reel (TR)/Cut Tape (CT)/Tray/Tube
RoHs Status - Lead free / RoHS Compliant
Package/Case - BGA
特征
The KLMDG8JENB-B041 components of Apogeeweb Electronics are carefully chosen, undergo stringent quality control, and are successfully meet all required standards.
KLMCG8GE2A-A001 with user guide manufactured by SAMSUNG. The KLMCG8GE2A-A001 is available in BGA Package, is part of the IC Chips.
KLMCG8GEAC-B031 with circuit diagram manufactured by SAMSUNG. The KLMCG8GEAC-B031 is available in BGA Package, is part of the IC Chips.
KLMCG8GEND-B031 with EDA / CAD Models manufactured by Samsung. The KLMCG8GEND-B031 is available in FBGA Package, is part of the IC Chips.
全新原包原装可含税(香港可交) KMGX6001BA-B514 KMGP6001BA-B514 KMFN60012M-B214 KMDX60018M-B425 KLMDG8JENB-B041 KLMCG4JETD-B041 KLMBG2JETD-B041 KLMAG1JETD-B041 KLM8G1GETF-B041 KLM4G1FETE-B041 K9F1G08U0E-SIB0 K4Z80325BC-HC14 K4G80325FC-HC25 K4E8E324ED-EGCG K4E8E324EB-EGCF K4E6E304EB-EGCF K4E6E304ED-EGCG K4E6E304EC-EGCG K4E6E304EC-EGCF K4B4G1646E-BYMA K4B4G1646E-BYK0 K4B4G1646E-BCNB K4E8E324EB-AGCF K4B4G0846E-BYMA K4AAG165WA-BCWE K4AAG165WA-BCTD K4A8G165WC-BCTD K4A8G165WC-BCRC K4A8G165WB-BCRC K4A4G165WF-BCTD K4A4G165WE-BCRC
KLMDG8JENB-B041
SAMSUNG/三星
BGA
23+
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