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H9HP27ADAMADAR-KMM原装EMCP 的技术参数:
制造商 |
SK HYNIX |
速率 |
3733Mbps |
RoHS |
是 |
NAND Mode |
eMMC 5.1 |
安装规格 |
表面贴装型 |
DRAM Mode |
LPDDR4x |
NAND Density |
32GB |
DRAM Density |
3GB |
Expanding the Possibilities of Mobile
Our high-density eMCP is a combination of 3D V4 256Gb NAND flash-based 128GB eMMC5.1 and 1xnm 8Gb DRAM-based 6GB LPDDR4X, packaged into an area-efficient design with stable functionality. The package fits neatly inside a range of compact devices where portability and mobility are crucial, especially in smartphones, wearables, and connected IoT devices.
Meeting a Wide Range of Mobile Needs
SKhynix的eMCPs今天已经广泛应用于移动设备中,随着移动应用的各种密度配置,其多样性继续扩大。
Area-efficient Package
我们的128GB+6GB LPDDR4X eMCP实现了4266Mbps的更快速度,比使用单独和离散的LPDDR和eMMC组件高40%。
MT29F64G08CBABBWPR:B
KLMBG2JETD-B041
KLMAG1JETD-B041
KLM8G1GETF-B041
KLM4G1FETE-B041
K4E8E324EB-EGCF
K4E6E304EB-EGCF
K4E6E304EC-EGCG
K4B4G1646E-BCNB
K4A8G165WB-BCRC
H9HP27ADAMADAR-KMM
SK Hynix /海力士
FBGA
21+/22+
无铅/环保