5AGXBA5D4F35C4N原装大量有货

地区:广东 深圳
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深圳市太航半导体有限公司

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FEATURES  5AGXBA5D4F35C4N5AGXBA5D4F35C4N5AGXBA5D4F35C4N5AGXBA5D4F35C4N

Technology:

55nm TSMC Embedded Flash (Flash + SRAM) process technology

Packaging:

Low cost and small package sizes

Multiple device densities with compatible package footprints for seamless migration between different device densities

RoHS6-compliant

Core Architecture:

4-input look-up table (LUT) and single register Logic Element (LE)

LEs arranged in Logic Array Block (LAB)

Embedded RAM and user flash memory

Clocks and PLLs

Embedded multiplier blocks

General purpose I/Os

Internal Memory Blocks:

M9K — 9-kilobits (Kb) memory blocks

Cascadable blocks to create RAM, dual port, and FIFO functions

User Flash Memory:

User accessible non-volatile storage

High speed operating frequency

Large memory size

High data retention

Multiple interface option

Embedded Hard IP Embedded Multiplier Blocks:

Support for one 18 x 18 or two 9 x 9 multiplier modes

Cascadable blocks enabling creation of filters, arithmetic functions, and image processing pipelines

ADC:

12-bits successive approximation register (SAR) type

Up to 17 analog inputs

Cumulative speed up to 1 million samples per second (MSPS)

Integrated temperature sensing capability



批号

2018

型号

5AGXBA5D4F35C4N

厂家

ALTERA

封装

BGA

系列

Arria V GX

说明

大量现货