XILINX全新原装芯片XQR2V3000-4CG717V编程逻辑集成电路进口现货BGA

Package Description35 X 35 MM, 1.27 MM PITCH, MS-034BAR-1, BGA-728CGA, CGA717,27X27,50Pin Count728717ECCN Code3A991.D9A515.E.2HTS Code8542.39.00.018542.39.00.01Clock Frequency-Max750 MHz650 MHzCombinatorial Delay of a CLB-Max0.39 ns0.44 nsJESD-30 CodeS-PBGA-B728S-CBGA-X717JESD-609 Codee0e0Length35 mm35 mmMoisture Sensitivity Level3Number of CLBs35843584Number of Equivalent Gates30000003000000Number of Inputs516516Number of Logic Cells3225632256Number of Outputs516516Number of Terminals728717Organization3584 CLBS, 3000000 GATES3584 CLBS, 3000000 GATESPackage Body MaterialPLASTIC/EPOXYCERAMIC, METAL-SEALED COFIREDPackage CodeBGACGAPackage Equivalence CodeBGA728,27X27,50CGA717,27X27,50Package ShapeSQUARESQUAREPackage StyleGRID ARRAYGRID ARRAYPeak Reflow Temperature (Cel)NOT SPECIFIEDNOT SPECIFIEDPower Supplies1.5,1.5/3.3,3.3 V1.5,1.5/3.3,3.3 VProgrammable Logic TypeFIELD PROGRAMMABLE GATE ARRAYFIELD PROGRAMMABLE GATE ARRAYQualification StatusNot QualifiedNot QualifiedSeated Height-Max2.6 mm3.3 mmSupply Voltage-Max1.575 V1.575 VSupply Voltage-Min1.425 V1.425 VSupply Voltage-Nom1.5 V1.5 VSurface MountYESYESTechnologyCMOSCMOSTerminal FinishTin/Lead (Sn63Pb37)TIN LEADTerminal FormBALLUNSPECIFIEDTerminal Pitch1.27 mm1.27 mmTerminal PositionBOTTOMBOTTOMTime@Peak Reflow Temperature-Max (s)NOT SPECIFIEDNOT SPECIFIEDWidth35 mm35 mmBase Number Matches11Operating Temperature-Max125 °COperating Temperature-Min-55 °C