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Description
TheIRF6716MPbFcombinesthelatestHEXFET®PowerMOSFETS
ilicontechnologywiththeadvancedDirectFETTMpackagingtoachieve
theloweston-stateresistanceinapackagethathasthefoo
tprintofaSO-8andonly0.6mmprofile.TheDirectFETpackageiscompatible
withexistinglayoutgeometriesusedinpowerapplication
s,PCBassemblyequipmentandvaporphase,infra-redorconvectionsoldering
techniques,whenapplicationnoteAN-1035isfollowedreg
ardingthemanufacturingmethodsandprocesses.TheDirectFETpackageallows
dualsidedcoolingtomaximizethermaltransferinpowersy
stems,improvingpreviousbestthermalresistanceby80%.
TheIRF6716MPbFbalancesbothlowresistanceandlowcharge
alongwithultralowpackageinductancetoreducebothconductionand
switchinglosses.Thereducedtotallossesmakethisproduct
idealforhighefficiencyDC-DCconvertersthatpowerthelatestgenerationof
processorsoperatingathigherfrequencies.TheIRF6716MPb
Fhasbeenoptimizedforparametersthatarecriticalinsynchronousbuck
IRF6716MTRPbF
IR
SMD/SMT
无铅环保型
贴片式
卷带编带包装
中功率
高频
39A
25V