供应5050陶瓷基板

       Ceramic substrates, ceramic circuit boards, Aluminium Nitride substrates, Aluminium Oxide substrates processing, line width and spacing can reach 50μm.

       Sun Yat-sen University Electronic Packaging Electrochemistry Lab, our processing techniques come from space technology.

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       To microelectronics companies, we adopt DPC technology to process ceramic circuits, meeting their demands for mass production of the ceramic circuits. To scientific research institutions, we provide the required chemicals for ceramic circuits processing. To researchers, we provide the services of magnetron sputtering, film and electroplating processing.

        The following is a brief introduction to 5050 standard edition, with sample pictures:

        Alumina purity is 96%, material plate thickness is 0.5mm, copper plating thickness is 65±15μm.

        The color of solder-resist ink is optional, you can choose double-sided white or green. Immersion silver thickness is 0.2-0.4μm.

        Plating layers on Side A

        The first layer: material: Ti; Thickness: 0.1μm;

        The second layer: material: Cu; Thickness: 65±10μm

        The third layer: material: Ag; Thickness: 0.2-0.5μm

        Plating layers on Side B

        The first layer: material: Ti; Thickness: 0.1μm;

        The second layer: material: Cu; Thickness: 65±10μm

        The third layer: material: Ag; Thickness: 0.2-0.5μm

        Solder-resist ink: white or green

        Thickness of solder-resist ink on side A: 10-13μm

        Thickness of solder-resist ink on side B: 10-20μm

        Hole cut copper plating, apertures are 53μm, 100μm, 53μm

        Size: 109.2mm*54.5mm/210pcs

        陶瓷基板，陶瓷线路板，氮化铝基板，氧化铝基板加工，线距线宽精度可以达到50微米，中山大学电子封装电化学实验室，加工工艺源于航空科技。联系：

        面向微电子公司，采用DPC技术加工陶瓷电路。解决客户陶瓷电路量产订单的加需求。

        面向科研院校提供陶瓷电路加工所需化学品。为研究者提供磁控溅射、菲林和电镀加工服务。

        以下是5050标准版的介绍，及生产线样片实拍照片： 

        氧化铝纯度96%，材料板厚0.5mm，镀铜厚度65±15μm，可选双面白色或者绿色阻焊油墨，沉银0.2-0.4μm。

        A面镀层情况

        镀层层数：第一层  材料种类：钛  厚度：0.1μm

        镀层层数：第二层  材料种类：铜  厚度：65±10μm

        镀层层数：第三层  材料种类：银  厚度：0.2-0.5μm

        B面镀层情况

        镀层层数：第一层  材料种类：钛  厚度：0.1μm

        镀层层数：第二层  材料种类：铜  厚度：65±10μm

        镀层层数：第三层  材料种类：银  厚度：0.2-0.5μm

        阻焊油墨：可选白色，绿色

        A面阻焊油墨厚度：10-13μm

        B面阻焊油墨厚度：10-20μm

        通孔镀铜，孔径53μm 100μm 53μm

        整片规格109.2mm*54.5mm/210pcs