HVC142AKRF-E RENESAS 丝印T6 • An optimal solution for antenna switching in mobile phones. • Low capacitance. (C = 0.35 pF max) • Low forward resistance. (rf = 1.3 Ω max) • Ultra small Flat Lead Package (UFP) is suitable for surface mount design. Reverse voltage VR: 30 V Forward current IF: 100 mA Power dissipation Pd: 150 mW Junction temperature Tj: 125 °C Storage temperature Tstg:−55 to +125 °C
