双面PCB RO3006 Rogers（罗杰斯）超高频线路板 射频微波行业

罗杰斯RO3006 ;

超高频线路板PCB ;

美国原厂原包装 ;

尺寸：12"*18"*厚度3.18mm; 

可剪裁陶瓷基底;

 介电常数：6.15;

数量：1张;

价格电谈

产品刚刚到货，保证全新原装，详细参数请参考罗杰斯厂家提供的产品PDF说明文档。非诚勿扰。

Property
Typical Value(1)
Direction Unit Condition Test Method
RO3003 RO3035 RO3006 RO3010
Dielectric Constant, r
Process
3.00 ±
0.04
3.50 ± 0.05 6.15 ± 0.15 10.2 ± 0.30 Z - 10 GHz 23°C
IPC-TM-650
2.5.5.5
Clamped
Stripline
(2) Dielectric Constant,r
Design
3.00 3.60 6.50 11.20 Z -
8 GHz - 40
GHz
Differential
Phase Length
Method
Dissipation Factor, tan  0.0010 0.0015 0.0020 0.0022 Z - 10 GHz 23°C
IPC-TM-650
2.5.5.5
Thermal Coeffi cient of r -3 -45 -262 -395 Z ppm/°C
10 GHz
-50 to 150°C
IPC-TM-650
2.5.5.5
Dimensional Stability
-0.06
0.07
-0.11
0.11
-0.27
-0.15
-0.35
-0.31
X
Y
mm/m COND A
IPC TM-650
2.2.4
Volume Resistivity05 105 M•cm COND A IPC 2.5.17.1
Surface Resistivity05 105 M COND A IPC 2.5.17.1
Tensile Modulus X, Y MPa 23°C ASTM D638
Moisture Absorption 0.04 0.04 0.02 0.05 - % D48/50
IPC-TM-650
2.6.2.1
Specifi c Heat 0.9 0.86 0.8 J/g/K Calculated
Thermal Conductivity 0.50 0.50 0.79 0.95 - W/m/K 50°C ASTM D5470
Coeffi cient of Thermal
Expansion
17
16
25
17
17
24
17
17
24
13
11
16
X
Y
Z
ppm/°C -55 to 288°C
ASTM
D3386-94
Td00 500 °C TGA ASTM D3850
Density 2.1 2.1 2.6 2.8
gm/
cm3 23°C ASTM D792
Copper Peel Strength 12.7 10.2 7.1 9.4 lb/in
1 oz. EDC
After Solder
Float
IPC-TM-2.4.8
Flammability V-0 V-0 V-0 V-0 UL 94
Lead Free Process
Compatible
YES YES YES YES