| 参数名称 | 参数值 |
|---|---|
| Source Content uid | PIC16F1937-I/PT |
| 是否无铅 |
 不含铅
|
| 是否Rohs |
 符合
|
| 生命周期 | Active |
| Objectid | 1576929721 |
| 零件包装代码 | QFP |
| 包装说明 | 10 X 10 MM, 1 MM HEIGHT, LEAD FREE, PLASTIC, TQFP-44 |
| 针数 | 44 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| HTS代码 | 8542.31.00.01 |
| Factory Lead Time | 5 weeks 2 days |
| 风险等级 | 0.89 |
| 具有ADC | YES |
| 其他特性 | ALSO OPERATES AT 1.8V MINIMUM SUPPLY FOR 16 MHZ |
| 地址总线宽度 | |
| 位大小 | 8 |
| CPU系列 | PIC |
| 大时钟频率 | 32 MHz |
| DAC 通道 | YES |
| DMA 通道 | NO |
| 外部数据总线宽度 | |
| JESD-30 代码 | S-PQFP-G44 |
| JESD-609代码 | e3 |
| 长度 | 10 mm |
| 湿度敏感等级 | 3 |
| I/O 线路数量 | 36 |
| 端子数量 | 44 |
| 片上程序ROM宽度 | 14 |
| 高工作温度 | 85 °C |
| 低工作温度 | -40 °C |
| PWM 通道 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TQFP |
| 封装等效代码 | TQFP44,.47SQ,32 |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 2/5 V |
| 状态 | Not Qualified |
| RAM（字节） | 512 |
| ROM（单词） | 8192 |
| ROM可编程性 | FLASH |
| 座面大高度 | 1.2 mm |
| 速度 | 32 MHz |
| 子类别 | Microcontrollers |
| 大压摆率 | 8 mA |
| 大供电电压 | 5.5 V |
| 小供电电压 | 2.3 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) - annealed |
| 端子形式 | GULL WING |
| 端子节距 | 0.8 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的长时间 | 40 |
| 宽度 | 10 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
型号
厂商
批号
封装
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